Display device with integrated touch screen and method of manufacturing the same

ABSTRACT

Disclosed are a display device with integrated touch screen and a method of manufacturing the same, which prevent the partial detachment of an organic layer. The display device includes a light emitting device layer including a first electrode disposed on a first substrate, a light emitting layer disposed on the first electrode, and a second electrode disposed on the light emitting layer and a touch sensing layer disposed on the light emitting device layer. The touch sensing layer includes a first touch electrode layer, a second touch electrode layer, and a touch insulation layer disposed therebetween, and the touch insulation layer includes a touch inorganic layer covering the second touch electrode layer and a touch organic layer disposed on the touch inorganic layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.17/090,538, filed Nov. 5, 2020, which is a continuation of U.S. patentapplication Ser. No. 16/023,304, filed Jun. 29, 2018, which claims thebenefit of the Korean Patent Application No. 10-2017-0083193 filed onJun. 30, 2017, which applications are hereby incorporated by referenceas if fully set forth herein.

BACKGROUND Technical Field

The present disclosure relates to a display device with integrated touchscreen and a method of manufacturing the same.

Description of the Related Art

With the advancement of information-oriented society, variousrequirements for display devices for displaying an image are increasing.Consequently, various display devices such as liquid crystal display(LCD) devices, plasma display panel (PDP) devices, and organic lightemitting display devices are being used recently. The organic lightemitting display devices have characteristics where driving is performedwith a low voltage, a thickness is thin, a viewing angle is good, and aresponse time is fast.

The organic light emitting display devices each include a display panelwhich includes a plurality of data lines, a plurality of scan lines, anda plurality of pixels respectively provided in a plurality of pixelareas defined by intersections of the data lines and the scan lines, ascan driver which respectively supplies scan signals to the scan lines,and a data driver which respectively supplies data voltages to the datalines. Each of the pixels includes an organic light emitting device, adriving transistor which controls the amount of current supplied to theorganic light emitting device according to a voltage of a gateelectrode, and a scan transistor which supplies a data voltage of acorresponding data line to the gate electrode of the driving transistorin response to a scan signal of a corresponding scan line.

Recently, the organic light emitting display devices are implemented asdisplay devices with integrated touch screen, which includes a touchscreen panel capable of sensing a user touch. In this case, the organiclight emitting display devices function as touch screen devices.Recently, the touch screen devices are applied to monitors such asnavigations, industrial terminals, notebook computers, financialautomation equipment, and game machines, portable terminals such asportable phones, MP3 players, personal digital assistants (PDAs),portable multimedia players (PMPs), play station portables (PSPs),portable game machines, digital multimedia broadcasting (DMB) receivers,and tablet personal computers (PCs), and home appliances such asrefrigerators, microwave ovens, and washing machines. Since all userscan easily manipulate the touch screen devices, the application of thetouch screen devices is being progressively expanded.

Display devices with integrated touch screen each include a plurality offirst touch electrodes, a plurality of second touch electrodes, and aplurality of bridge electrodes for connecting the first touch electrodesto the second touch electrodes, which are provided in a display panel.The first touch electrodes may be Tx electrodes, and the second touchelectrodes may be Rx electrodes.

The first touch electrodes and the second touch electrodes may beprovided on the same layer, and the bridge electrodes may be provided ona layer which differs from a layer on which the first touch electrodesand the second touch electrodes are provided. In this case, in order toinsulate the first and second touch electrodes from the bridgeelectrodes, an organic layer may be provided between the first andsecond touch electrodes and the bridge electrodes. For example, as inFIG. 1, an organic layer PAC may be provided on bridge electrodes BE,and a first touch electrode TE and a second touch electrode may beprovided on the organic layer PAC. Alternatively, the organic layer PACmay be provided on the first touch electrode TE and the second touchelectrode, and the bridge electrodes BE may be provided on the organiclayer PAC. In this case, an interface adhesive force between the organiclayer PAC and the first touch electrode TE, the second touch electrode,or the bridge electrodes BE is not high, and due to this, as in FIG. 1,the organic layer PAC can be partially detached from the first touchelectrode TE, the second touch electrode, or the bridge electrodes BE.

BRIEF SUMMARY

Accordingly, the present disclosure is directed to provide a displaydevice with integrated touch screen and a method of manufacturing thesame that substantially obviate one or more problems due to limitationsand disadvantages of the related art.

In one or more embodiments, the present disclosure provides a displaydevice with integrated touch screen and a method of manufacturing thesame, which prevent the partial detachment of an organic layer.

Additional advantages and features of the disclosure will be set forthin part in the description which follows and in part will becomeapparent to those having ordinary skill in the art upon examination ofthe following or may be learned from practice of the disclosure. Theobjectives and other advantages of the disclosure may be realized andattained by the structure particularly pointed out in the writtendescription and claims hereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof the disclosure, as embodied and broadly described herein, in oneembodiment, a display device with integrated touch screen is provided,the display device including a light emitting device layer including afirst electrode disposed on a first substrate, a light emitting layerdisposed on the first electrode, and a second electrode disposed on thelight emitting layer and a touch sensing layer disposed on the lightemitting device layer. The touch sensing layer includes a first touchelectrode layer, a second touch electrode layer, and a touch insulationlayer between the first and second touch electrode layers. The touchinsulation layer includes a touch inorganic layer covering the secondtouch electrode layer and a touch organic layer disposed on the touchinorganic layer.

In another embodiment of the present disclosure, there is provided amethod that includes: forming a first electrode on a first substrate;forming a light emitting layer on the first electrode; forming a secondelectrode on the light emitting layer; forming a first touch electrodelayer on the second electrode; forming a touch insulation layer on thefirst touch electrode layer; and forming a second touch electrode layeron the touch insulation layer. The forming of the touch insulation layerincludes forming a touch inorganic layer covering the first touchelectrode layer and forming a touch organic layer on the touch inorganiclayer.

It is to be understood that both the foregoing general description andthe following detailed description of the present disclosure areexemplary and explanatory and are intended to provide furtherexplanation of the disclosure as claimed.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosure and are incorporated in and constitute apart of this application, illustrate embodiments of the disclosure andtogether with the description serve to explain the principle of thedisclosure. In the drawings:

FIG. 1 is an exemplary diagram illustrating the partial detachment of anorganic layer from a bridge electrode;

FIG. 2 is a perspective view illustrating a display device withintegrated touch screen according to an embodiment of the presentdisclosure;

FIG. 3 is a block diagram illustrating a display device with integratedtouch screen according to an embodiment of the present disclosure;

FIG. 4 is a cross-sectional view of one side of a display panel of FIG.2;

FIG. 5 is a plan view illustrating first and second touch electrodes,bridge electrodes, and first and second touch lines of a display devicewith integrated touch screen according to an embodiment of the presentdisclosure;

FIG. 6 is an enlarged view illustrating in detail an example of a regionA of FIG. 5, in accordance with one or more embodiments of the presentdisclosure;

FIG. 7 is a cross-sectional view illustrating an example taken alongline I-I′ of FIG. 5;

FIG. 8 is a cross-sectional view illustrating an example taken alongline II-II′ of FIG. 6;

FIG. 9 is a flowchart illustrating a method of manufacturing a displaydevice with integrated touch screen according to an embodiment of thepresent disclosure; and

FIGS. 10A, 10B, 10C, and 10D are cross-sectional views for describing amethod of manufacturing a display device with integrated touch screenaccording to an embodiment of the present disclosure.

DETAILED DESCRIPTION

Reference will now be made in detail to the exemplary embodiments of thepresent disclosure, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.

In the specification, it should be noted that like reference numeralsalready used to denote like elements in other drawings are used forelements wherever possible. In the following description, when afunction and a configuration known to those skilled in the art areirrelevant to the essential configuration of the present disclosure,their detailed descriptions will be omitted. The terms described in thespecification should be understood as follows.

Advantages and features of the present disclosure, and implementationmethods thereof will be clarified through following embodimentsdescribed with reference to the accompanying drawings. The presentdisclosure may, however, be embodied in different forms and should notbe construed as limited to the embodiments set forth herein. Rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the scope of the present disclosureto those skilled in the art.

A shape, a size, a ratio, an angle, and a number disclosed in thedrawings for describing embodiments of the present disclosure are merelyan example, and thus, the present disclosure is not limited to theillustrated details. Like reference numerals refer to like elementsthroughout. In the following description, when the detailed descriptionof the relevant known function or configuration is determined tounnecessarily obscure the important point of the present disclosure, thedetailed description will be omitted.

In a case where ‘comprise,’ ‘have,’ and ‘include’ described in thepresent specification are used, another part may be added unless ‘only˜’is used. The terms of a singular form may include plural forms unlessreferred to the contrary.

In construing an element, the element is construed as including an errorrange although there is no explicit description.

In describing a position relationship, for example, when a positionrelation between two parts is described as ‘on˜,’ ‘over˜,’ ‘under˜,’ and‘next˜,’ one or more other parts may be disposed between the two partsunless exclusively limited by terms such as ‘just’ or ‘direct’.

In describing a time relationship, for example, when the temporal orderis described as ‘after˜,’ ‘subsequent˜,’ ‘next˜,’ and ‘before˜,’ a casewhich is not continuous may be included unless ‘just’ or ‘direct’ isused.

It will be understood that, although the terms “first,” “second,” etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the present disclosure.

An X axis direction, a Y axis direction, and a Z axis direction shouldnot be construed as only a geometric relationship where a relationshiptherebetween is vertical, and may denote having a broader directionalitywithin a scope where elements of the present disclosure operatefunctionally.

The term “at least one” should be understood as including any and allcombinations of one or more of the associated listed items. For example,the meaning of “at least one of a first item, a second item, and a thirditem” denotes the combination of all items proposed from two or more ofthe first item, the second item, and the third item as well as the firstitem, the second item, or the third item.

Features of various embodiments of the present disclosure may bepartially or overall coupled to or combined with each other, and may bevariously inter-operated with each other and driven technically as thoseskilled in the art can sufficiently understand. The embodiments of thepresent disclosure may be carried out independently from each other, ormay be carried out together in co-dependent relationship.

Hereinafter, exemplary embodiments of the present disclosure will bedescribed in detail with reference to the accompanying drawings.

FIG. 2 is a perspective view illustrating a display device withintegrated touch screen according to an embodiment of the presentdisclosure. FIG. 3 is a block diagram illustrating a display device withintegrated touch screen according to an embodiment of the presentdisclosure.

Referring to FIGS. 2 and 3, the display device with integrated touchscreen according to an embodiment of the present disclosure may includea display panel 110, a scan driver 120, a data driver 130, a timingcontroller 160, a host system 170, a touch driver 180, and a touchcoordinate calculator 190.

The display device with integrated touch screen according to anembodiment of the present disclosure may be implemented with an LCDdevice, a field emission display (FED) device, a PDP device, an organiclight emitting display device, an electrophoresis display (EPD) device,or the like. Hereinafter, an example where the display device withintegrated touch screen according to an embodiment of the presentdisclosure is implemented with an organic light emitting display devicewill be described, but the present disclosure is not limited thereto.

The display panel 110 may include a first substrate 111 and a secondsubstrate 112. The second substrate 112 may be an encapsulationsubstrate. The first substrate 111 may be a plastic film, a glasssubstrate, or the like. The second substrate 112 may be a plastic film,a glass substrate, an encapsulation film (a protective film), or thelike.

The display panel 110 may include a display area where a plurality ofsubpixels SP are provided to display an image. A plurality of data linesD1 to Dm (where m is a positive integer equal to or more than two) and aplurality of scan lines S1 to Sn (where n is a positive integer equal toor more than two) may be provided. The data lines D1 to Dm may beprovided to intersect the scan lines S1 to Sn. The subpixels SP may berespectively provided in a plurality of areas defined by an intersectionstructure of the data lines D1 to Dm and the scan lines S1 to Sn.

Each of the subpixels SP of the display panel 110 may be connected toone of the data lines D1 to Dm and one of the scan lines S1 to Sn. Eachof the subpixels SP of the display panel 110 may include a drivingtransistor which controls a drain-source current according to a datavoltage applied to a gate electrode, a scan transistor which is turnedon by a scan signal of a scan line and supplies the data voltage of adata line to the gate electrode of the driving transistor, an organiclight emitting diode (OLED) which emits light with the drain-sourcecurrent of the driving transistor, and a capacitor which stores avoltage at the gate electrode of the driving transistor. Therefore, eachof the subpixels SP may emit light with a current supplied to the OLED.

The scan driver 120 may receive a scan control signal GCS from thetiming controller 160. The scan driver 120 may supply scan signals tothe scan lines 51 to Sn according to the scan control signal GCS.

The scan driver 120 may be provided in a non-display area outside oneside or both sides of a display area of the display panel 110 in a gatedriver-in panel (GIP) type. Alternatively, the scan driver 120 may bemanufactured as a driving chip and may be mounted on a flexible film,and moreover, may be attached on the non-display area outside the oneside or the both sides of the display area of the display panel 110 in atape automated bonding (TAB) type.

The data driver 130 may receive digital video data DATA and a datacontrol signal DCS from the timing controller 160. The data driver 130may convert the digital video data DATA into analog positive/negativedata voltages according to the data control signal DCS and may supplythe data voltages to the data lines. That is, subpixels to which thedata voltages are to be supplied may be selected by the scan signals ofthe scan driver 120, and the data voltages may be supplied to theselected subpixels.

The data driver 130, as in FIG. 2, may include a plurality of sourcedrive integrated circuits (ICs) 131. Each of the plurality of sourcedrive ICs 131 may be mounted on a flexible film 140 in a chip-on film(COF) type or a chip-on plastic (COP) type. The flexible film 140 may beattached on a plurality of pads provided in the non-display area of thedisplay panel 110 by using an anisotropic conductive film, and thus, theplurality of source drive ICs 131 may be connected to the pads.

The flexible film 140 may be provided in plurality, and a circuit board150 may be attached on the flexible films 140. A plurality of circuitsrespectively implemented as driving chips may be mounted on the circuitboard 150. For example, the timing controller 160 may be mounted on thecircuit board 150. The circuit board 150 may be a printed circuit board(PCB) or a flexible printed circuit board (FPCB).

The timing controller 160 may receive the digital video data DATA andtiming signals from the host system 170. The timing signals may includea vertical synchronization signal, a horizontal synchronization signal,a data enable signal, a dot clock, etc. The vertical synchronizationsignal may be a signal that defines one frame period. The horizontalsynchronization signal may be a signal that defines one horizontalperiod necessary for supplying data voltages to subpixels of onehorizontal line of the display panel 110. The data enable signal may bea signal that defines a period where valid data is input. The dot clockmay be a signal that is repeated at a certain short period.

The timing controller 160 may generate the data control signal DCS forcontrolling an operation timing of the data driver 130 and the scancontrol signal GCS for controlling an operation timing of the scandriver 120 so as to control the operation timing of each of the scandriver 120 and the data driver 130, based on the timing signals. Thetiming controller 160 may output the scan control signal GCS to the scandriver 120 and may output the digital video data DATA and the datacontrol signal DCS to the data driver 130.

The host system 170 may be implemented as a navigation system, a set-topbox, a DVD player, a blue-ray player, a personal computer (PC), a hometheater system, a broadcasting receiver, a phone system, or the like.The host system 170 may include a system-on chip (SoC) with a scalerembedded therein and may convert the digital video data DATA of an inputimage into a format suitable for displaying the image on the displaypanel 110. The host system 170 may transmit the digital video data DATAand the timing signals to the timing controller 160.

In addition to the data lines D1 to Dm and the scan lines S1 to Sn, aplurality of first and second touch electrodes may be provided in thedisplay panel 110. The first touch electrodes may be provided tointersect the second touch electrodes. The first touch electrodes may beconnected to a first touch driver 181 through a plurality of first touchlines T1 to Tj (where j is a positive integer equal to or more thantwo). The second touch electrodes may be connected to a second touchdriver 182 through a plurality of second touch lines R1 to Ri (where iis a positive integer equal to or more than two). A plurality of touchsensors may be respectively provided in intersection portions of thefirst touch electrodes and the second touch electrodes. In an embodimentof the present disclosure, each of the touch sensors may be exemplarilyimplemented with a mutual capacitor, but is not limited thereto. Adisposition structure of the first and second touch electrodes will bedescribed below in detail with reference to FIG. 5.

The touch driver 180 may supply a driving pulse to the first touchelectrodes through the first touch line T1 to Tj and may sense chargingvariations of the touch sensors through the second touch lines R1 to Ri.That is, in FIG. 3, it is described that the first touch line T1 to Tjare Tx lines through which the driving pulse is supplied, and the secondtouch lines R1 to Ri are Rx lines through which the charging variationsof the touch sensors are respectively sensed.

The touch driver 180 may include a first touch driver 181, a secondtouch driver 182, and a touch controller 183. The first touch driver181, the second touch driver 182, and the touch controller 183 may beintegrated into one readout integrated chip (ROIC).

The first touch driver 181 may select a first touch line through whichthe driving pulse is to be output, based on control by the touchcontroller 183 and may supply the driving pulse to the selected firsttouch line. For example, the driving pulse may be provided in plurality,and the first touch driver 181 may sequentially supply the drivingpulses to the first touch lines T1 to Tj.

The second touch driver 182 may select second touch lines through whichcharging variations of touch sensors are to be received, based oncontrol by the touch controller 183 and may receive the chargingvariations of the touch sensors through the selected second touch lines.The second touch driver 182 may sample the charging variations of thetouch sensors received through the second touch lines R1 to Ri toconvert the charging variations into touch raw data TRD which aredigital data.

The touch controller 183 may generate a Tx setup signal for setting afirst touch line, to which the driving pulse is to be output from thefirst touch driver 181, and an Rx setup signal for setting a secondtouch line through which a touch sensor voltage is to be received by thesecond touch driver 182. Also, the touch controller 183 may generatetiming control signals for controlling the operation timings of thefirst touch driver 181 and the second touch driver 182.

The touch coordinate calculator 190 may receive the touch raw data TRDfrom the touch driver 180. The touch coordinate calculator 190 maycalculate touch coordinates, based on a touch coordinate calculationmethod and may output touch coordinate data HIDxy, including informationabout the touch coordinates, to the host system 170.

The touch coordinate calculator 190 may be implemented with a microcontroller unit (MCU). The host system 170 may analyze the touchcoordinate data HIDxy input from the touch coordinate calculator 190 toexecute an application program associated with coordinates where a touchhas been performed by a user. The host system 170 may transmit thedigital video data DATA and the timing signals to the timing controller160 according to the executed application program.

The touch driver 180 may be included in the source drive ICs 131, or maybe manufactured as a separate driving chip and mounted on the circuitboard 150. Also, the touch coordinate calculator 190 may be manufacturedas a separate driving chip and mounted on the circuit board 150.

FIG. 4 is a cross-sectional view of one side of a display panel of FIG.2.

Referring to FIG. 4, the display panel 110 may include a first substrate111, a second substrate 112, a thin film transistor (TFT) layer 10disposed between the first and second substrates 111 and 112, a lightemitting device layer 20, an encapsulation layer 30, a touch sensinglayer 40, and an adhesive layer 50.

The first substrate 111 may be a plastic film, a glass substrate, or thelike.

The TFT layer 10 may be formed on the first substrate 111. The TFT layer10 may include the scan lines, the data lines, and a plurality of TFTs.The TFTs may each include a gate electrode, a semiconductor layer, asource electrode, and a drain electrode. In a case where the scan driveris provided as the GIP type, the scan driver may be formed along withthe TFT layers 10. The TFT layer 10 will be described below in detailwith reference to FIGS. 7 to 9.

The light emitting device layer 20 may be formed on the TFT layer 10.The light emitting device layer 20 may include a plurality of firstelectrodes, a light emitting layer, a second electrode, and a pluralityof banks. The light emitting layer may include an organic light emittinglayer including an organic material. In this case, the light emittinglayer may include a hole transporting layer, an organic light emittinglayer, and an electron transporting layer. When a voltage is applied tothe first electrode and the second electrode, a hole and an electronmove to the organic light emitting layer through the hole transportinglayer and the electron transporting layer and are combined with eachother in the organic light emitting layer to emit light. The lightemitting device layer 20 may be a pixel array layer where pixels areprovided, and thus, an area where the light emitting device layer 20 isprovided may be defined as a display area. A peripheral area of thedisplay area may be defined as a non-display area. The light emittingdevice layer 20 will be described below in detail with reference toFIGS. 7 to 9.

The encapsulation layer 30 may be formed on the light emitting devicelayer 20. The encapsulation layer 30 prevents oxygen or water frompenetrating into the light emitting device layer 20. The encapsulationlayer 30 may include at least one inorganic layer and at least oneorganic layer. A cross-sectional structure of the encapsulation layer 30will be described below in detail with reference to FIGS. 7 to 9.

The touch sensing layer 40 may be formed on the encapsulation layer 30.The touch sensing layer 40 may include first and second touch electrodelayers for sensing a user touch. The first touch electrode layer mayinclude a plurality of first touch electrodes connected to the firsttouch lines T1 to Tj and a plurality of second touch electrodesconnected to the second touch lines R1 to Ri. The second touch electrodelayer may include a plurality of bridge electrodes which connect thefirst touch electrodes or the second touch electrodes. In an embodimentof the present disclosure, since the touch sensing layer 40 for sensinga user touch is formed on the encapsulation layer 30, it is not requiredthat a touch screen device is separately attached on a display device. Aplane structure of the touch sensing layer 40 will be described belowwith reference to FIGS. 5 and 6. Also, a cross-sectional structure ofthe touch sensing layer 40 will be described below in detail withreference to FIGS. 7 to 9.

The adhesive layer 50 may be formed on the touch sensing layer 40. Theadhesive layer 50 may attach the second substrate 112 on the firstsubstrate 111 on which the TFT layer 10, the light emitting device layer20, the encapsulation layer 30, and the touch sensing layer 40 areprovided. The adhesive layer 50 may be an optically clear resin (OCR)layer, an optically clear adhesive (OCA) film, or the like.

The second substrate 112 may act as a cover substrate or a cover window,which covers the first substrate 111. The second substrate 112 may be aplastic film, a glass substrate, an encapsulation film (a protectivefilm), or the like.

FIG. 5 is a plan view illustrating first and second touch electrodes,bridge electrodes, and first and second touch lines of a display devicewith integrated touch screen according to an embodiment of the presentdisclosure.

Referring to FIG. 5, a plurality of first touch electrodes TE may bearranged in a first direction (an X-axis direction), and a plurality ofsecond touch electrodes RE may be arranged in a second direction (aY-axis direction) intersecting the first direction (the X-axisdirection). The first direction (the X-axis direction) may be adirection parallel to the scan lines S1 to Sn, and the second direction(the Y-axis direction) may be a direction parallel to the data lines D1to Dm. Alternatively, the first direction (the X-axis direction) may bea direction parallel to the data lines D1 to Dm, and the seconddirection (the Y-axis direction) may be a direction parallel to the scanlines S1 to Sn. In FIG. 5, an example where the first touch electrodesTE and the second touch electrodes RE have a diamond-shaped planestructure is illustrated, but the present embodiment is not limitedthereto.

In order to prevent the first touch electrodes TE and the second touchelectrodes RE from being short-circuited in intersection areastherebetween, the first touch electrodes TE which are adjacent to eachother in the first direction (the X-axis direction) may be electricallyconnected to one another through a plurality of bridge electrodes BE. Amutual capacitance corresponding to a touch sensor may be generated inan intersection area of each of the first touch electrodes TE and acorresponding second touch electrode RE.

Moreover, each of first touch electrodes TE connected to each other inthe first direction (the X-axis direction) may be spaced apart from andelectrically insulated from first touch electrodes TE adjacent theretoin the second direction (the Y-axis direction). Each of second touchelectrodes RE connected to each other in the second direction (theY-axis direction) may be spaced apart from and electrically insulatedfrom second touch electrodes RE adjacent thereto in the first direction(the X-axis direction).

A first touch electrode TE, disposed in one side end among first touchelectrodes TE connected to each other in the first direction (the X-axisdirection), may be connected to a first touch line TL. The first touchline TL may be connected to the first touch driver 181 through a firsttouch pad TP. Therefore, the first touch electrodes TE connected to eachother in the first direction (the X-axis direction) may receive a touchdriving signal from the first touch driver 181 through the first touchline TL.

A second touch electrode RE, disposed in one side end among second touchelectrodes RE connected to each other in the second direction (theY-axis direction), may be connected to a second touch line RL. Thesecond touch line RL may be connected to the second touch driver 182through a second touch pad RP. Therefore, the second touch driver 182may receive charging variations of touch sensors of the second touchelectrodes RE connected to each other in the second direction (theY-axis direction).

FIG. 6 is an enlarged view illustrating in detail an example of a regionA of FIG. 5.

Referring to FIG. 6, a plurality of pixels P may be provided in apentile structure. Each of the pixels P may include a plurality ofsubpixels SP, and for example, as in FIG. 6, may include one redsubpixel R, two green subpixels G, and one subblue pixel B. The redsubpixel R, the green subpixels G, and the blue subpixel B may beprovided as an octagonally planar type. Also, a size of the bluesubpixel B may be largest, and a size of each of the green subpixels Gmay be smallest. In FIG. 6, an example where the pixels P are providedin the pentile structure is illustrated, but the present embodiment isnot limited thereto.

The first touch electrodes TE and the second touch electrodes RE may beprovided in a mesh structure so as not to overlap the red pixel R, thegreen pixels G, and the blue pixel B of the pixels P. That is, the firsttouch electrodes TE and the second touch electrodes RE may be providedon a bank which is provided between the red pixel R, the green pixels G,and the blue pixel B.

First touch electrodes TE which are adjacent to each other in the firstdirection (the X-axis direction) may be electrically connected to eachother through a plurality of bridge electrodes BE. The bridge electrodesBE may be respectively connected to first touch electrodes TE adjacentto each other through first contact holes CT1 exposing the first touchelectrodes TE. Each of the bridge electrodes BE may overlap acorresponding first touch electrode TE and a corresponding second touchelectrode RE. Each of the bridge electrodes BE may be provided on thebank which is provided between the red pixel R, the green pixels G, andthe blue pixel B.

The bridge electrodes BE may have a bar structure like “-” as well as abended structure like “∧,” “∨,” “<” or “>” as shown in FIG. 6, but theembodiments of the present disclosure are not limited thereto. Thebridge electrodes BE are not overlapped with the red pixel R, the greenpixels G, and the blue pixel B of the pixel P. Therefore, if the bridgeelectrodes BE have the bended structure, the bridge electrodes BE areoverlapped with a left first touch electrode TE, a second touchelectrode RE, and a right first touch electrode TE as shown in FIG. 6.Also, The bridge electrodes BE are formed as a mesh type.

The first and second touch electrodes TE and RE may be disposed on thesame layer, and the bridge electrodes BE may be disposed on a layerwhich differs from a layer on which the first and second touchelectrodes TE and RE are disposed.

FIG. 7 is a cross-sectional view illustrating an example taken alongline I-I′ of FIG. 5. FIG. 8 is a cross-sectional view illustrating anexample taken along line II-II′ of FIG. 6.

In FIG. 7, a connection structure of the second touch line RL and thesecond touch pad RP is illustrated in detail. In FIG. 8, a connectionstructure of the bridge electrode BE and the first touch electrodes TEis illustrated in detail.

Referring to FIGS. 7 and 8, a TFT layer 10 may be formed on a firstsubstrate 111. The TFT layer 10 may include a plurality of TFTs 210,first and second touch pads TP and RP, a gate insulation layer 220, aninterlayer insulation layer 230, a passivation layer 240, and aplanarization layer 250.

A first buffer layer may be formed on one surface of the first substrate111. The first buffer layer may be formed on the one surface of thefirst substrate 111, for protecting the TFTs 210 and a plurality oforganic light emitting devices 260 from water penetrating through thefirst substrate 111 vulnerable to penetration of water. The one surfaceof the first substrate 111 may be a surface facing the second substrate112. The first buffer layer may be formed of a plurality of inorganiclayers which are alternately stacked. For example, the first bufferlayer may be formed of a multilayer where one or more inorganic layersof silicon oxide (SiOx), silicon nitride (SiNx), and SiON arealternately stacked. The first buffer layer may be omitted.

The TFTs 210 may be formed on the first buffer layer. The TFTs 210 mayeach include an active layer 211, a gate electrode 212, a sourceelectrode 214, and a drain electrode 215. In FIG. 8, the TFTs 210 areexemplarily illustrated as being formed as a top gate type where thegate electrode 212 is disposed on the active layer 211, but is notlimited thereto. That is, the TFTs 210 may be formed as a bottom gatetype where the gate electrode 212 is disposed under the active layer 211or a double gate type where the gate electrode 212 is disposed both onand under the active layer 211.

The active layer 211 may be formed on the first buffer layer. The activelayer 211 may be formed of a silicon-based semiconductor material, anoxide-based semiconductor material, and/or the like. A light blockinglayer (not shown) for blocking external light incident on the activelayer 211 may be formed between the first buffer layer and the activelayer 211.

The gate insulation layer 220 may be formed on the active layer 211. Thegate insulation layer 220 may be formed of an inorganic layer, and forexample, may be formed of SiOx, SiNx, or a multilayer thereof.

The gate electrode 212 and a gate line may be formed on the gateinsulation layer 220. The gate electrode 212 and the gate line may eachbe formed of a single layer or a multilayer which includes one ofmolybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti),nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

The interlayer insulation layer 230 may be formed on the gate electrode212 and the gate line. The interlayer insulation layer 230 may be formedof an inorganic layer, and for example, may be formed of SiOx, SiNx, ora multilayer thereof.

The source electrode 214, the drain electrode 215, a data line, andfirst and second touch pads TP and RP may be formed on the interlayerinsulation layer 230. Each of the source electrode 214 and the drainelectrode 215 may be connected to the active layer 211 through a contacthole which passes through the gate insulation layer 220 and theinterlayer insulation layer 230. The source electrode 214, the drainelectrode 215, the data line, and the first and second touch pads TP andRP may each be formed of a single layer or a multilayer which includesone of Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu, or an alloy thereof.

The passivation layer 240 for insulating the TFTs 220 may be formed onthe source electrode 214, the drain electrode 215, the data line, andthe first and second touch pads TP and RP. The passivation layer 240 maybe formed of an inorganic layer, and for example, may be formed of SiOx,SiNx, or a multilayer thereof.

The planarization layer 250 for planarizing a step height caused by theTFTs 210 may be formed on the passivation layer 240. The planarizationlayer 250 may be formed of an organic layer such as acryl resin, epoxyresin, phenolic resin, polyamide resin, polyimide resin, or the like.

The light emitting device layer 20 may be formed on the TFT layer 10.The light emitting device layer 20 may include a plurality of lightemitting devices and a bank 270.

The light emitting devices and the bank 270 may be formed on theplanarization layer 250. The light emitting devices may each include afirst electrode 261, an organic light emitting layer 262, and a secondelectrode 263. The first electrode 261 may be an anode electrode, andthe second electrode 263 may be a cathode electrode.

The first electrode 261 may be formed on the planarization layer 250.The first electrode 261 may be connected to the source electrode 214 ofthe TFT 210 through a contact hole which passes through the passivationlayer 240 and the planarization layer 250. The first electrode 261 maybe formed of a metal material, which is high in reflectivity, such as astacked structure (Ti/Al/Ti) of Al and Ti, a stacked structure(ITO/Al/ITO) of Al and ITO, an APC alloy, or a stacked structure(ITO/APC/ITO) of an APC alloy and ITO. The APC alloy may be an alloy ofAg, palladium (Pd), and Cu.

The bank 270 may be formed on the planarization layer 250 to divide thefirst electrode 261, for acting as a pixel defining layer which definesa plurality of subpixels SP. The bank 270 may be formed to cover an edgeof the first electrode 261.

Each of the subpixels SP may denote an area where the first electrode261 corresponding to an anode electrode, the light emitting layer 262,and the second electrode 263 corresponding to a cathode electrode aresequentially stacked, and a hole from the first electrode 261 and anelectron from the second electrode 263 are combined with each other inthe light emitting layer 262 to emit light.

The light emitting layer 262 may be formed on the first electrode 261and the bank 270. The light emitting layer 262 may be an organic lightemitting layer which includes an organic material and emits light havinga certain color. In a case where the light emitting layer 262 is a whitelight emitting layer emitting white light, the light emitting layer 262may be a common layer which is formed in the pixels P in common. In thiscase, the light emitting layer 262 may be formed in a tandem structureincluding two or more stacks. Each of the stacks may include a holetransporting layer, at least one light emitting layer, and an electrontransporting layer.

Moreover, a charge generating layer may be formed between the stacks.The charge generating layer may include an n-type charge generatinglayer, disposed adjacent to a lower stack, and a p-type chargegenerating layer which is formed on the n-type charge generating layerand is disposed adjacent to an upper stack. The n-type charge generatinglayer may inject an electron into the lower stack, and the p-type chargegenerating layer may inject a hole into the upper stack. The n-typecharge generating layer may be formed of an organic layer where alkalimetal, such as lithium (Li), sodium (Na), potassium (K), or cesium (Cs),or alkali earth metal such as magnesium (Mg), strontium (Sr), barium (Ba), or radium (Ra) is doped on an organic host material having anability to transport electrons. The p-type charge generating layer maybe an organic layer where a dopant is doped on an organic materialhaving an ability to transport holes.

The second electrode 263 may be formed on the light emitting layer 262.The second electrode 263 may be formed to cover the light emitting layer262. The second electrode 263 may be a common layer which is formed inthe plurality of pixels P in common.

The second electrode 263 may be formed of a transparent conductivematerial (or TCO), such as indium tin oxide (ITO) or indium zinc oxide(IZO) capable of transmitting light, or a semi-transmissive conductivematerial such as Mg, Ag, or an alloy of Mg and Ag. If the secondelectrode 263 is formed of a semi-transmissive conductive material,emission efficiency is enhanced by a micro-cavity. A capping layer maybe formed on the second electrode 263.

The encapsulation layer 30 may be formed on the light emitting devicelayer 260. The encapsulation layer 30 may include an encapsulation film280.

The encapsulation film 280 may be formed on the second electrode 263.The encapsulation film 280 may include at least one inorganic layer andat least one organic layer, for preventing oxygen or water frompenetrating into the light emitting layer 262 and the second electrode263. For example, as in FIGS. 7 and 8, the encapsulation film 280 mayinclude first and second inorganic layers 281 and 283 and an organiclayer 282 disposed between the first and second inorganic layers 281 and283. Each of the first and second inorganic layers 281 and 283 may beformed of silicon nitride, aluminum nitride, zirconium nitride, titaniumnitride, hafnium nitride, tantalum nitride, silicon oxide, aluminumoxide, titanium oxide, and/or the like. The organic layer 282 may beformed to have a sufficient thickness (for example, a thickness of about7 μm to 8 μm), for preventing particles from penetrating into the lightemitting layer 262 and the second electrode 263 via the encapsulationfilm 280.

A flow of the organic layer 282 may be blocked by a dam 300, and thus,the organic layer 282 may be provided more inward than the dam 300. Onthe other hand, the first and second inorganic layers 281 and 283 may beprovided more outward than the dam 300. Also, the first and secondinorganic layers 281 and 283 may be provided not to cover the first andsecond touch pads TP and RP.

A second buffer layer 31 may be formed on the encapsulation layer 30.The second buffer layer 31 may be formed to cover the encapsulationlayer 280 and the first and second touch pads TP and RP. The thicknessof the second buffer layer 31 may be determined by considering adistance between the bridge electrodes 293 and the second electrode 263.If the distance between the bridge electrodes 293 and the secondelectrode 263 is more than 5 μm, parasitic capacitances between thebridge electrodes 293 and the second electrode 263 may be reduced.Therefore, the embodiments of the present disclosure may prevent thesecond electrode 263 from being affected by the coupling between bridgeelectrodes 293 and the second electrode 263 due to the parasiticcapacitances.

The second buffer layer 31 may be formed of an inorganic layer or anorganic layer. In a case where the second buffer layer 31 is formed ofan inorganic layer, the second buffer layer 31 may be formed of SiOx,SiNx, or a multilayer thereof. In a case where the second buffer layer31 is formed of an organic layer, a surface roughness of the secondbuffer layer 31 is roughened by performing plasma treatment on thesecond buffer layer 31. In this case, an area of the second buffer layer31 contacting the bridge electrodes 293 of the first touch electrodelayer 41 is enlarged, and thus, an interface adhesive force between thesecond buffer layer 31 and the bridge electrodes 293 of the first touchelectrode layer 41 increases.

The touch sensing layer 40 may be formed on the second buffer layer 31.The touch sensing layer 40 may include a first touch electrode layer 41,a second touch electrode layer 42, and a touch insulation layer 43.

The first touch electrode layer 41 may include first and second touchelectrodes 291 and 292. That is, the first and second touch electrodes291 and 292 may be disposed on the same layer. The first and secondtouch electrodes 291 and 292 may be spaced apart and electricallyinsulated from each other. The second touch electrode layer 42 mayinclude a plurality of bridge electrodes 293. The touch insulation layer43 may include a touch inorganic layer 294 and a touch organic layer295.

In detail, the bridge electrodes 293 may be formed on the second bufferlayer 31. The bridge electrodes 293 may each be formed of a single layeror a multilayer which includes one of Mo, Al, Cr, Au, Ti, Ni, Nd, andCu, or an alloy thereof.

The touch inorganic layer 294 may be formed on the bridge electrodes293. The touch inorganic layer 294 may be formed of an inorganic layer,and for example, may be formed of SiOx, SiNx, or a multilayer thereof.

The touch organic layer 295 may be formed on the touch inorganic layer294. An interface adhesive force between the bridge electrodes 293 andthe touch inorganic layer 294 is higher than an interface adhesive forcebetween the bridge electrodes 293 and the touch organic layer 295, andthus, if the touch inorganic layer 294 is provided between the bridgeelectrodes 293 and the touch organic layer 295, the touch organic layer295 is prevented from being partially detached between the bridgeelectrodes 293 and the touch organic layer 295.

The organic layer 282 of the encapsulation film 280 may be a particlecover layer for preventing particles from penetrating into the lightemitting layer 282 and the second electrode 263 via the encapsulationfilm 280, but the touch organic layer 295 may be a layer which allowsthe first touch electrode layer 41 to be spaced apart from the secondtouch electrode layer 42 by a certain distance. Therefore, the touchorganic layer 295 may be formed to have a thickness which is thinnerthan that of the organic layer 282 of the encapsulation film 280. Forexample, the touch organic layer 295 may be formed to have a thicknessof about 2 μm. Also, a contact hole may not be provided in the organiclayer 282 of the encapsulation film 280, and thus, the organic layer 282of the encapsulation film 280 may not include a photosensitive material.On the other hand, contact holes may be provided in the touch organiclayer 295, and thus, the touch organic layer 295 may include aphotosensitive material. For example, the touch organic layer 295 may beformed of photo acrylate including a photosensitive material.

The first touch electrodes 291 and the second touch electrodes 292 maybe formed on the touch organic layer 295. The first touch electrodes291, as in FIG. 8, may be connected to the bridge electrodes 293 throughfirst contact holes CT1 which pass through the touch inorganic layer 294and the touch organic layer 295 and expose the bridge electrodes 293.Therefore, the first touch electrodes 291 may be connected to each otherby using the bridge electrodes 293 in intersection areas of the firsttouch electrodes 291 and the second touch electrodes 292, and thus, thefirst touch electrodes 291 and the second touch electrodes 292 are notshort-circuited with one another. Also, the first touch electrodes 291and the second touch electrodes 292 may be disposed to overlap the bank270 so as to prevent an opening area of each subpixel SP from beingreduced.

A first touch line TL may extend from the first touch electrode 291, anda second touch line RL may extend from the second touch electrode 292.The first touch line TL may be connected to the first touch pad TPthrough a second contact hole CT2 which passes through the passivationlayer 240 and the second buffer layer 31 and exposes the first touch padTP. The second touch line RL may be connected to the second touch pad RPthrough a third contact hole CT3 which passes through the passivationlayer 240 and the second buffer layer 31 and exposes the second touchpad RP, as shown in FIG. 7.

The first touch electrodes 291, the second touch electrodes 292, thefirst touch lines TL, and the second touch lines RL may each be formedof a single layer or a multilayer which includes one of Mo, Al, Cr, Au,Ti, Ni, Nd, and Cu, or an alloy thereof.

An overcoat layer 296 for planarizing a step height caused by the firstand second touch electrodes 291 and 292 and the bridge electrodes 293may be formed on the first and second touch electrodes 291 and 292.

In FIG. 8, an example where the second touch electrode layer 42 isprovided on the second buffer layer 31, the touch insulation layer 43 isprovided on the second touch electrode layer 42, and the first touchelectrode layer 41 is provided on the touch insulation layer 43 isillustrated, but the present embodiment is not limited thereto. In otherembodiments, the first touch electrode layer 41 may be provided on thesecond buffer layer 31, the touch insulation layer 43 may be provided onthe first touch electrode layer 41, and the second touch electrode layer42 may be provided on the touch insulation layer 43.

A color filter layer may be formed on the touch sensing layer 40. Thecolor filter layer may include a plurality of color filters, disposed tooverlap subpixels SP, and a black matrix disposed to overlap the bank270. In a case where the light emitting layer 262 includes a pluralityof organic light emitting layers which emit red, green, and blue lights,the color filter layer may be omitted.

The adhesive layer 50 may be formed on the touch sensing layer 40. Theadhesive layer 50 may attach the second substrate 112 on the firstsubstrate 111 on which the TFT layer 10, the light emitting device layer20, the encapsulation layer 30, and the touch sensing layer 40 areprovided. The adhesive layer 50 may be an OCR layer, an OCA film, or thelike.

The second substrate 112 may act as a cover substrate or a cover window,which covers the first substrate 111. The second substrate 112 may be aplastic film, a glass substrate, an encapsulation film (a protectivefilm), or the like.

As described above, in the present embodiment, the touch inorganic layer294 may be formed on the bridge electrodes 293 of the second touchelectrode layer 42, and then, the touch organic layer 295 may be formedon the touch inorganic layer 294. In the embodiments of the presentdisclosure, since an interface adhesive force between the bridgeelectrodes 293 and the touch inorganic layer 294 is higher than aninterface adhesive force between the bridge electrodes 293 and the touchorganic layer 295, the touch organic layer 295 is prevented from beingpartially detached between the bridge electrodes 293 and the touchorganic layer 295.

FIG. 9 is a flowchart illustrating a method of manufacturing a displaydevice with integrated touch screen according to an embodiment of thepresent disclosure. FIGS. 10A to 10D are cross-sectional views fordescribing a method of manufacturing a display device with integratedtouch screen according to an embodiment of the present disclosure. FIGS.10A to 10D illustrate the cross-sectional views taken along line II-II′of FIG. 6 illustrated in FIG. 8.

Hereinafter, a method of manufacturing a display device with integratedtouch screen according to an embodiment of the present disclosure willbe described in detail with reference to FIGS. 9 and FIGS. 10A through10D.

First, as in FIG. 10A, a TFT layer 10, an organic light emitting device20, and an encapsulation layer 30 may be formed on a first substrate111.

In detail, a first buffer layer may be formed on the first substrate 111before forming a TFT 210. The first buffer layer is for protecting theTFT 210 and an organic light emitting device 260 from water penetratingthrough the first substrate 111 vulnerable to penetration of water andmay be formed of a plurality of inorganic layers which are alternatelystacked. For example, the first buffer layer may be formed of amultilayer where one or more inorganic layers of SiOx, SiNx, and SiONare alternately stacked. The first buffer layer may be formed by achemical vapor deposition (CVD) process.

Subsequently, an active layer 211 of the TFT 210 may be formed on thefirst buffer layer. In detail, an active metal layer may be formed on awhole surface of the first buffer layer by using a sputtering process, ametal organic chemical vapor deposition (MOCVD) process, and/or thelike. Subsequently, the active layer 211 may be formed by patterning theactive metal layer through a mask process using a photoresist pattern.The active layer 211 may be formed of a silicon-based semiconductormaterial or an oxide-based semiconductor material.

Subsequently, a gate insulation layer 220 may be formed on the activelayer 211. The gate insulation layer 220 may be formed of an inorganiclayer, and for example, may be formed of SiOx, SiNx, or a multilayerthereof.

Subsequently, a gate electrode 212 of the TFT 210 may be formed on thegate insulation layer 220. In detail, a first metal layer may be formedon a whole surface of the gate insulation layer 220 by using asputtering process, an MOCVD process, and/or the like. Subsequently, thegate electrode 212 may be formed by patterning the first metal layerthrough a mask process using a photoresist pattern. The gate electrode212 may be formed of a single layer or a multilayer which includes oneof Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu, or an alloy thereof.

Subsequently, an interlayer insulation layer 230 may be formed on thegate electrode 212. The interlayer insulation layer 230 may be formed ofan inorganic layer, and for example, may be formed of SiOx, SiNx, or amultilayer thereof.

Subsequently, a plurality of contact holes which pass through the gateinsulation layer 220 and the interlayer insulation layer 230 and exposethe active layer 211 may be formed.

Subsequently, a source electrode 214 and a drain electrode 215 includedin the TFT 210 may be formed on the interlayer insulation layer 230. Indetail, a second metal layer may be formed on a whole surface of theinterlayer insulation layer 230 by using a sputtering process, an MOCVDprocess, and/or the like. Subsequently, the source electrode 214 and thedrain electrode 215 may be formed by patterning the second metal layerthrough a mask process using a photoresist pattern. The source electrode214 and the drain electrode 215 may be connected to the active layer 211through the contact holes which pass through the gate insulation layer220 and the interlayer insulation layer 230. The source electrode 214and the drain electrode 215 may each be formed of a single layer or amultilayer which includes one of Mo, Al, Cr, Au, Ti, Ni, Nd, and Cu, oran alloy thereof.

Subsequently, a passivation layer 240 may be formed on the sourceelectrode 214 and the drain electrode 215 of the TFT 210. Thepassivation layer 240 may be formed of an inorganic layer, and forexample, may be formed of SiOx, SiNx, or a multilayer thereof. Thepassivation layer 240 may be formed by a CVD process.

Subsequently, a planarization layer 250 for planarizing a step heightcaused by the TFT 210 may be formed on the passivation layer 240. Theplanarization layer 250 may be formed of an organic layer such as acrylresin, epoxy resin, phenolic resin, polyamide resin, polyimide resin,and/or the like.

Subsequently, a first electrode 261 included in the organic lightemitting device layer 20 may be formed on the planarization layer 250.In detail, a third metal layer may be formed on a whole surface of theplanarization layer 250 by using a sputtering process, an MOCVD process,and/or the like. Subsequently, the first electrode 261 may be formed bypatterning the third metal layer through a mask process using aphotoresist pattern. The first electrode 261 may be connected to thesource electrode 214 of the TFT 210 through a contact hole which passesthrough the passivation layer 240 and the planarization layer 250. Thefirst electrode 261 may be formed of a metal material, which is high inreflectivity, such as a stacked structure (Ti/Al/Ti) of Al and Ti, astacked structure (ITO/Al/ITO) of Al and ITO, an APC alloy, or a stackedstructure (ITO/APC/ITO) of an APC alloy and ITO.

Subsequently, a bank 270 may be formed on the planarization layer 250 tocover an edge of the first electrode 261, for dividing a plurality ofsubpixels SP. The bank 270 may be formed of an organic layer such asacryl resin, epoxy resin, phenolic resin, polyamide resin, polyimideresin, and/or the like.

Subsequently, a light emitting layer 262 may be formed on the firstelectrode 261 and the bank 270. The light emitting layer 262 may be anorganic light emitting layer. In this case, the organic light emittinglayer 262 may be formed on the first electrode 261 and the bank 270through a deposition process or a solution process. The organic lightemitting layer 262 may be a common layer which is formed in pixels P1 toP3 in common. In this case, the organic light emitting layer 262 may bea white light emitting layer which emits white light.

If the organic light emitting layer 262 is the white light emittinglayer, the organic light emitting layer 262 may be formed in a tandemstructure including two or more stacks. Each of the stacks may include ahole transporting layer, at least one light emitting layer, and anelectron transporting layer.

Moreover, a charge generating layer may be formed between the stacks.The charge generating layer may include an n-type charge generatinglayer, disposed adjacent to a lower stack, and a p-type chargegenerating layer which is formed on the n-type charge generating layerand is disposed adjacent to an upper stack. The n-type charge generatinglayer may inject an electron into the lower stack, and the p-type chargegenerating layer may inject a hole into the upper stack. The n-typecharge generating layer may be formed of an organic layer where alkalimetal, such as lithium (Li), sodium (Na), potassium (K), or cesium (Cs),or alkali earth metal such as magnesium (Mg), strontium (Sr), barium (Ba), or radium (Ra) is doped on an organic host material having anability to transport electrons. The p-type charge generating layer maybe formed by doping a dopant on an organic material having an ability totransport holes.

Subsequently, a second electrode 263 may be formed on the organic lightemitting layer 262. The second electrode 263 may be a common layer whichis formed in the pixels P1 to P3 in common. The second electrode 263 maybe formed of a transparent conductive material (or TCO) such as ITO orIZO capable of transmitting light. The second electrode 263 may beformed through a physical vapor deposition (PVD) process such as asputtering process and/or the like. A capping layer may be formed on thesecond electrode 263.

Subsequently, an encapsulation film 280 may be formed on the secondelectrode 263. The encapsulation film 280 prevents oxygen or water frompenetrating into the organic light emitting layer 262 and the secondelectrode 263. To this end, the encapsulation film 280 may include atleast one inorganic layer. The inorganic layer may be formed of siliconnitride, aluminum nitride, zirconium nitride, titanium nitride, hafniumnitride, tantalum nitride, silicon oxide, aluminum oxide, titaniumoxide, and/or the like.

Moreover, the encapsulation film 280 may further include at least oneorganic layer. The organic layer may be formed to have a sufficientthickness, for preventing particles from penetrating into the organiclight emitting layer 262 and the second electrode 263 via theencapsulation film 280.

A process of forming the at least one inorganic layers 281 and 283 andthe organic layer 282 of the encapsulation film 280 may be performed asa low temperature process performed at a low temperature of 100° C. orless, for preventing the previously formed organic light emitting layer262 from being damaged by a high temperature. (S101 of FIG. 9)

Second, as in FIG. 10B, a second buffer layer 31 may be formed on theencapsulation layer 30. The second buffer layer 31 may be formed tocover the encapsulation layer 280 and the first and second touch pads TPand RP. The second buffer layer 31 may be formed of an inorganic layeror an organic layer. In a case where the second buffer layer 31 isformed of an inorganic layer, the second buffer layer 31 may be formedof SiOx, SiNx, or a multilayer thereof. In a case where the secondbuffer layer 31 is formed of an organic layer, a surface roughness ofthe second buffer layer 31 is roughened by performing plasma treatmenton the second buffer layer 31. In this case, an area of the secondbuffer layer 31 contacting the bridge electrodes 293 of the first touchelectrode layer 41 is enlarged, and thus, an interface adhesive forcebetween the second buffer layer 31 and the bridge electrodes 293 of thefirst touch electrode layer 41 increases.

A process of forming the second buffer layer 31 may be performed as alow temperature process performed at a low temperature of 100° C. orless, for preventing the previously formed organic light emitting layer262 from being damaged by a high temperature.

Second, as in FIG. 10B, a second touch electrode layer 42 including aplurality of bridge electrodes 291 may be formed on the second bufferlayer 31. In detail, a fourth metal layer may be formed on a wholesurface of the second buffer layer 31 by using a sputtering process, anMOCVD process, and/or the like. Subsequently, the bridge electrodes 291may be formed by patterning the fourth metal layer through a maskprocess using a photoresist pattern. The bridge electrodes 291 may beformed in a multi-layer structure including a plurality of electrodes,and for example, may be formed in a three-layer structure of Ti/Al/Ti.(S102 of FIG. 9)

Third, as in FIG. 10C, a touch insulation layer 43 including a touchinorganic layer 294 and a touch organic layer 295 may be formed on thesecond touch electrode layer 42.

In detail, the touch inorganic layer 294 may be formed on the secondtouch electrode layer 42. The touch inorganic layer 294 may be formed ofSiOx, SiNx, or a multilayer thereof.

Subsequently, the touch organic layer 295 may be formed on the touchinorganic layer 294. An interface adhesive force between the bridgeelectrodes 293 and the touch inorganic layer 294 is higher than aninterface adhesive force between the bridge electrodes 293 and the touchorganic layer 295, and thus, if the touch inorganic layer 294 isprovided between the bridge electrodes 293 and the touch organic layer295, the touch organic layer 295 is prevented from being partiallydetached between the bridge electrodes 293 and the touch organic layer295.

The organic layer 282 of the encapsulation film 280 may be a particlecover layer for preventing particles from penetrating into the lightemitting layer 282 and the second electrode 263 via the encapsulationfilm 280, but the touch organic layer 295 may be a layer which allowsthe first touch electrode layer 41 to be spaced apart from the secondtouch electrode layer 42 by a certain distance. Therefore, the touchorganic layer 295 may be formed to have a thickness which is thinnerthan that of the organic layer 282 of the encapsulation film 280. Forexample, the touch organic layer 295 may be formed to have a thicknessof about 2 μm.

Subsequently, a plurality of first contact holes CT1 which pass throughthe touch inorganic layer 294 and the touch organic layer 295 and exposethe bridge electrodes 293 may be formed. Also, as in FIG. 7, a pluralityof second contact holes CT2 which pass through the passivation layer 240and the second buffer layer 31 and expose the first touch pads TP may beformed, and a plurality of third contact holes CT3 which pass throughthe passivation layer 240 and the second buffer layer 31 and expose thesecond touch pads RP may be formed.

A contact hole may not be provided in the organic layer 282 of theencapsulation film 280, and thus, the organic layer 282 of theencapsulation film 280 may not include a photosensitive material. On theother hand, contact holes may be provided in the touch organic layer295, and thus, the touch organic layer 295 may include a photosensitivematerial. For example, the touch organic layer 295 may be formed ofphoto acrylate including a photosensitive material.

A process of forming the touch inorganic layer 294 and the touch organiclayer 295 may be performed as a low temperature process performed at alow temperature of 100° C. or less, for preventing the previously formedorganic light emitting layer 262 from being damaged by a hightemperature. (S103 of FIG. 9)

Fourth, as in FIG. 10D, a plurality of first touch electrodes 291 and aplurality of second touch electrodes 292 may be formed on the touchinsulation layer 43.

In detail, a fifth metal layer may be formed on a whole surface of thetouch insulation layer 43 by using a sputtering process, an MOCVDprocess, and/or the like. Subsequently, the first and second touchelectrodes 291 and 292 may be formed by patterning the fifth metal layerthrough a mask process using a photoresist pattern. The first touchelectrodes 291 may be connected to the bridge electrode 291 through thefirst contact hole CT1 passing through the touch inorganic layer 291 andthe touch organic layer 295. The first and second touch electrodes 291and 292 may each be formed in a multi-layer structure including aplurality of electrodes, and for example, may be formed in a three-layerstructure of Ti/Al/Ti.

A first touch line TL may extend from the first touch electrode 291, anda second touch line RL may extend from the second touch electrode 292.The first touch line TL, as in FIG. 7, may be connected to the firsttouch pad TP through the second contact hole CT2 which passes throughthe passivation layer 240 and the second buffer layer 31. The secondtouch line RL may be connected to the second touch pad RP through thethird contact hole CT3 which passes through the passivation layer 240and the second buffer layer 31.

The first touch electrodes 291, the second touch electrodes 292, thefirst touch line TL, and the second touch line RL may each be formed ofa single layer or a multilayer which includes one of Mo, Al, Cr, Au, Ti,Ni, Nd, and Cu, or an alloy thereof.

Moreover, an overcoat layer 296 for planarizing a step height caused bythe first and second touch electrodes 291 and 292 and the bridgeelectrodes 293 may be formed on the first and second touch electrodes291 and 292. (S104 of FIG. 9)

Moreover, a color filter layer may be formed on the touch sensing layer40. The color filter layer may include a plurality of color filters,disposed to overlap subpixels SP, and a black matrix disposed to overlapthe bank 270. In a case where the light emitting layer 262 includes aplurality of organic light emitting layers which emit red, green, andblue lights, the color filter layer may be omitted.

Subsequently, the first substrate 111 may be attached on the secondsubstrate 112 by an adhesive layer 50. The adhesive layer 50 may be anOCR layer, an OCA film, or the like.

As described above, in the present embodiment, the touch inorganic layer294 may be formed on the bridge electrodes 293 of the second touchelectrode layer 42, and then, the touch organic layer 295 may be formedon the touch inorganic layer 294. In the embodiments of the presentdisclosure, since an interface adhesive force between the bridgeelectrodes 293 and the touch inorganic layer 294 is higher than aninterface adhesive force between the bridge electrodes 293 and the touchorganic layer 295, the touch organic layer 295 is prevented from beingpartially detached between the bridge electrodes 293 and the touchorganic layer 295.

As described above, according to the embodiments of the presentdisclosure, the touch inorganic layer may be formed on the bridgeelectrodes of the second touch electrode layer, and then, the touchorganic layer may be formed on the touch inorganic layer. In theembodiments of the present disclosure, since an interface adhesive forcebetween the bridge electrodes and the touch inorganic layer is higherthan an interface adhesive force between the bridge electrodes and thetouch organic layer, the touch organic layer is prevented from beingpartially detached between the bridge electrodes and the touch organiclayer.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present disclosurewithout departing from the spirit or scope of the disclosures. Thus, itis intended that the present disclosure covers the modifications andvariations of this disclosure provided they come within the scope of theappended claims and their equivalents.

The various embodiments described above can be combined to providefurther embodiments. These and other changes can be made to theembodiments in light of the above-detailed description. In general, inthe following claims, the terms used should not be construed to limitthe claims to the specific embodiments disclosed in the specificationand the claims, but should be construed to include all possibleembodiments along with the full scope of equivalents to which suchclaims are entitled. Accordingly, the claims are not limited by thedisclosure.

1. A display device comprising: a substrate including a display area inwhich a plurality of pixels are provided and a non-display area adjacentto the display area; a pad disposed in the non-display area of thesubstrate; a light emitting device layer disposed in the display area ofthe substrate; a dam on the substrate, the dam being disposed betweenthe display area and the pad; an encapsulation layer on the lightemitting device layer, the encapsulation layer including a firstinorganic layer disposed on the light emitting device layer, a secondinorganic layer disposed on the first inorganic layer, and an organiclayer disposed between the first inorganic layer and the secondinorganic layer; a bridge electrode disposed on the second inorganiclayer; a touch insulation layer disposed on the bridge electrode, thetouch insulation layer including a touch inorganic layer and a touchorganic layer; a plurality of first touch electrodes disposed on thetouch insulation layer, and arranged in a first direction; and aplurality of second touch electrodes disposed on the touch insulationlayer, and arranged in a second direction intersecting the firstdirection, wherein the touch organic layer has a thickness which isthinner than a thickness of the organic layer of the encapsulationlayer.
 2. The display device of claim 1, wherein the second inorganiclayer of the encapsulation layer covers the dam.
 3. The display deviceof claim 1, wherein the bridge electrode is electrically connected withthe plurality of first touch electrodes through a contact hole of thetouch inorganic layer and the touch organic layer.
 4. The display deviceof claim 1, wherein the touch inorganic layer covers the bridgeelectrode, and the touch organic layer is disposed on the touchinorganic layer,
 5. The display device of claim 1, wherein the firsttouch electrodes and the second touch electrodes are disposed on thesame layer, and the bridge electrode is disposed on a layer differentfrom a layer on which the first touch electrodes and the second touchelectrodes are disposed.
 6. The display device of claim 3, wherein thefirst touch electrodes are connected to each other in the firstdirection through the bridge electrode, and the second touch electrodesare connected to each other in the second direction.
 7. The displaydevice of claim 6, wherein the bridge electrode is respectivelyconnected to the first touch electrodes adjacent to each other throughthe contact hole.
 8. The display device of claim 1, wherein the padincluding a first touch pad electrically connected to the first touchelectrodes and a second touch pad electrically connected to the secondtouch electrodes.
 9. The display device of claim 1, further comprising:a buffer layer disposed between the second inorganic layer of theencapsulation layer and the bridge electrode.
 10. The display device ofclaim 9, wherein the buffer layer covers the dam and a lateral surfaceof the second inorganic layer.
 11. The display device of claim 8,further comprising: a first touch line extending from the first touchelectrodes, the first touch line being connected to the first touch pad;and a second touch line extending from the second touch electrodes, thesecond touch line being connected to the second touch pad.
 12. Thedisplay device of claim 10, wherein the second touch line covers thedam.
 13. The display device of claim 1, wherein the touch insulationlayer is disposed between the bridge electrode and the first and secondtouch electrodes.